Barrier and micro-structuring
Our capability
- Customized micro-device fabrication by semiconductor processes
Available processes
- PE-CVD (SiNx, SiOx )
- Spin-on-Glass
- Sputtering/electroplating
Customer benefit
- For advanced electronics ventures
- For consumer electronics makers
- Customers can prove their novel concept of next wave technologies
Low temperature (~60 ℃) barrier deposition & patterning
Anisotropic dry-etching
Isotropic dry-etching
Overhang-micro-structuring
